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Friday, 10 February 2017

Bridging the Gap Between RF Front-End Module Characterization and Production Test With the Semiconductor Test System

Sponsored by National Instruments
The rapid evolution of wireless connectivity has driven the continual consumer thirst for more data throughput and reduced time to market. This white paper highlights some of the test challenges and explains how NI PXI instrumentation is meeting these demands in both characterization and production test environments with the same hardware and software platform.

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http://ift.tt/2ke41PF

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